Boot repair with medusa
Repair IMEI and unlock
Code:
Connecting...
CPU name : Qualcomm MSM8610
Flash Id : 909201
Device : Hynix eMMC H4G1d
Page size : 512 B
Block size : 512 B
Block count : 7634944
Size : 3728.00 MB
Connect successful.
---------------------------------------------------------------
SW: 1.6.4; FW: 1.24.
P00: GPT (00000000, 00000022) 17 KB
P01: sbl1 (00000022, 00000400) 512 KB
P02: sdi (00000422, 00000040) 32 KB
P03: DDR (00002000, 00000040) 32 KB
P04: rpm (00004000, 000003E8) 500 KB
P05: tz (000043E8, 000003E8) 500 KB
P06: aboot (000047D0, 00002BB0) 5.461 MB
P07: pad (00007380, 00000800) 1024 KB
P08: oeminfo (00007B80, 00020000) 64 MB
P09: modemst1 (00027B80, 00002000) 4 MB
P10: modemst2 (00029B80, 00002000) 4 MB
P11: modem (0002C000, 00030000) 96 MB
P12: fsg (0005C000, 00002000) 4 MB
P13: fsc (0005E000, 00000002) 1024 b
P14: ssd (0005E002, 00000010) 8 KB
P15: log (0005E012, 00010000) 32 MB
P16: bkbootup (00070000, 00020000) 64 MB
P17: persist (00090000, 00004000) 8 MB
P18: boot (00094000, 00006000) 12 MB
P19: recovery (0009A000, 00008000) 16 MB
P20: cust (000A2000, 00080000) 256 MB
P21: cache (00122000, 00060000) 192 MB
P22: misc (00182000, 00002000) 4 MB
P23: system (00184000, 00200000) 1024 MB
P24: userdata (00384000, 00200000) 1024 MB
P25: grow (00584000, 001DBFDF) 952 MB
Repairing from file "H:/Installed Boxes/Medusa/Install/Medusa Pro Software/firmwareFolder/HUAWEI_Y530-U00_EMMC_H4G1D.SRF".
Write data verification is enabled.
Writing GPT partition... Done.
Writing sbl1 partition... Done.
Writing sdi partition... Done.
Writing DDR partition... Done.
Writing rpm partition... Done.
Writing tz partition... Done.
Writing aboot partition... Done.
Writing pad partition... Done.
Writing oeminfo partition... Done.
Writing modemst1 partition... Done.
Writing modemst2 partition... Done.
Writing modem partition... Done.
Writing fsg partition... Done.
Writing fsc partition... Done.
Writing ssd partition... Done.
Writing log partition... Done.
Writing bkbootup partition... Done.
Writing persist partition... Done.
Writing boot partition... Done.
Writing recovery partition... Done.
Writing cust partition... Done.
Writing cache partition... Done.
Writing misc partition... Done.
Writing system partition... Done.
Writing userdata partition... Done.
Writing grow partition... Done.
Smart Repair is successfully complete.
SW: 1.6.4; FW: 1.24.
Disconnected.
Repair IMEI and unlock
Code:
Smart-Clip 2 v.1.28.06
255271261 Smart-Clip 2 dongle 1.28, Initializing...OK
Pack 2: Activated
Pack 3: Activated
Pack 4: Activated
Pack 5: Activated
--------- 2018-08-04 11:29:02 ---------
Smart-Clip 2 1.28.06 Qcom: Repair
DBAdapter Reserved Interface (COM135), Provider: Huawei Incorporated, Driver ver.: 2.0.6.714, Date: 12/28/2015, USB\VID_12D1&PID_1035&REV_0228&MI_04
Removing firmware protection...OK
Firmware: MPSS.TR.1.0-01760-M8610BAAAANAZM-1
Date: Aug 1 2014 16:15:28, Dec 04 2013 07:00:00, BAAAANTZ
Software IMEI: Not found
Bluetooth address: DADD9201E760
Modem Version: MSM8x1xC900B509_AMSS Aug 1 201416:15:28; HW Version: HD1Y530M_VERA
System Version: Y530-U00V100R001C900B510_SYSTEM; Baseband Processor: MSM8210
Phone model: Y530_U00; Provider: dt / sk
Repairing IMEI...868909020606250
Restarting phone...Done
--------- 2018-08-04 11:38:30 ---------
Smart-Clip 2 1.28.06 Qcom: Direct unlock
DBAdapter Reserved Interface (COM135), Provider: Huawei Incorporated, Driver ver.: 2.0.6.714, Date: 12/28/2015, USB\VID_12D1&PID_1035&REV_0228&MI_04
Removing firmware protection...OK
Firmware: MPSS.TR.1.0-01760-M8610BAAAANAZM-1
Date: Aug 1 2014 16:15:28, Dec 04 2013 07:00:00, BAAAANTZ
Software IMEI: 868909020606250
Bluetooth address: DADD9201E760
Modem Version: MSM8x1xC900B509_AMSS Aug 1 201416:15:28; HW Version: HD1Y530M_VERA
System Version: Y530-U00V100R001C900B510_SYSTEM; Baseband Processor: MSM8210
Phone model: Y530_U00; Provider: dt / sk
Security area saved to "C:\Users\**********\Documents\Smart-Clip 2\security backup\0255271261\868909020606250_Y530_U00.skb"
Unlocking phone...Done
Restarting phone....Done
