Model Settings:
Interface : eMMC
Brand : Samsung
Model : SM-J110H
SRF : C:/Program Files/Medusa Pro Software/firmwareFolder/SAMSUNG_SM-J110H_EMMC.srf
Voltage : 1.8V
Bus Mode : 1 bit
Bus speed : Auto
Connecting...
Device : Hynix eMMC H4G2b
Page size : 512 B
Block size : 512 B
Block count : 7634944
Size : 3728.00 MB
---------------------------------------------------------------
CID Info
CID : 90014A4834473262110143403D111363
Manufacturer ID : 0X90
Device/BGA : BGA (Discrete embedded)
OEM/Application ID : 0X4A
Product name : H4G2b
Product revision : 0.1
Product serial number : (hex) 43403D11
Manufacturing date : 01/2016
---------------------------------------------------------------
CSD Info
CSD : D07F01320F5903FFFFFFFFEF8A4040DB
CSD structure : CSD version No. 1.2
SPEC version : 4.1, 4.2, 4.3, 4.4, 4.41, 4.5,
4.51, 5.0, 5.01, 5.1
Data read access time1: 80 ms
TRAN speed : 26 MHz
READ block length : 512 Bytes
WP group enable : YES
PERM_WRITE_PROTECT : NO
TMP_WRITE_PROTECT : NO
---------------------------------------------------------------
EXTCSD Info
Revision 1.6 (for MMC v4.5, v4.51)
Erase block size : 512 Kbytes
Boot1 size : 4096 Kbytes
Boot2 size : 4096 Kbytes
RPMB size : 4096 Kbytes
Partition config : (0x08) 00001000
Boot partition enable : Boot partition 1
(Bus width = 1Bit)
Boot ACK : No boot acknowledge sent (default)
Boot bus conditions : (0x00) 00000000
Boot bus width : x1 (sdr) or x4 (ddr) bus width in boot operation mode (default)
Reset boot bus conditions : Reset bus width to x1, single data rate and backward compatible timings after boot operation (default)
Boot mode : Use single data rate + backward compatible timings in boot operation (default)
RST_n function : (0x00) RST_n signal is temporary disabled (default)
Partitioning support : Device supports partitioning features
Enhanced attribute : Device can have enhanced technological features in partitions and user data area.
Max enhanced data size: 1908736 Kbytes
Partitions attribute : 0x0
Part setting completed: 0x0
GP partition 1 size : 0 b
GP partition 2 size : 0 b
GP partition 3 size : 0 b
GP partition 4 size : 0 b
Enhanced area size : (0x0) 0 b
Enhanced area start : (0x0) 0 b
---------------------------------------------------------------Searching Android build info...
Not found
---------------------------------------------------------------
Backup EXT_CSD saved to file C:/Program Files/Medusa Pro Software/EXT_CSD Backups/H4G2b_27_09_2018_12_55_26.bin.
Connect successful.
---------------------------------------------------------------
SW: 1.6.7; FW: 1.24.
P00: PART_EE (00000001, 00743FFF) 3720 MB
Repairing from file "C:/Program Files/Medusa Pro Software/firmwareFolder/SAMSUNG_SM-J110H_EMMC.srf".
Write data verification is enabled.
Switched to boot area partition 1.
Writing BOOT1 partition... Done.
Switched to boot area partition 2.
Writing BOOT2 partition... Done.
Switched to user area.
Writing GPT partition... Done.
Writing SBOOT partition... Done.
Writing SBOOT2 partition... Done.
Writing wfixnv1 partition... Done.
Writing wfixnv2 partition... Done.
Writing tdfixnv1 partition... Done.
Writing tdfixnv2 partition... Done.
Writing WDSP partition... Done.
Writing MODEM partition... Done.
Writing MODEM2 partition... Done.
Writing TDDSP partition... Done.
Writing FOTA_SIG partition... Done.
Writing wruntimenv1 partition... Done.
Writing wruntimenv2 partition... Done.
Writing tdruntimenv1 partition... Done.
Writing tdruntimenv2 partition... Done.
Writing PARAM partition... Done.
Writing EFS partition... Done.
Writing PRODNV partition... Done.
Writing RESERVED2 partition... Done.
Writing KERNEL partition... Done.
Writing RECOVERY partition... Done.
Writing PERSDATA partition... Done.
Writing CSC partition... Done.
Smart Repair is successfully complete.
SW: 1.6.7; FW: 1.24.
Disconnected.
Interface : eMMC
Brand : Samsung
Model : SM-J110H
SRF : C:/Program Files/Medusa Pro Software/firmwareFolder/SAMSUNG_SM-J110H_EMMC.srf
Voltage : 1.8V
Bus Mode : 1 bit
Bus speed : Auto
Connecting...
Device : Hynix eMMC H4G2b
Page size : 512 B
Block size : 512 B
Block count : 7634944
Size : 3728.00 MB
---------------------------------------------------------------
CID Info
CID : 90014A4834473262110143403D111363
Manufacturer ID : 0X90
Device/BGA : BGA (Discrete embedded)
OEM/Application ID : 0X4A
Product name : H4G2b
Product revision : 0.1
Product serial number : (hex) 43403D11
Manufacturing date : 01/2016
---------------------------------------------------------------
CSD Info
CSD : D07F01320F5903FFFFFFFFEF8A4040DB
CSD structure : CSD version No. 1.2
SPEC version : 4.1, 4.2, 4.3, 4.4, 4.41, 4.5,
4.51, 5.0, 5.01, 5.1
Data read access time1: 80 ms
TRAN speed : 26 MHz
READ block length : 512 Bytes
WP group enable : YES
PERM_WRITE_PROTECT : NO
TMP_WRITE_PROTECT : NO
---------------------------------------------------------------
EXTCSD Info
Revision 1.6 (for MMC v4.5, v4.51)
Erase block size : 512 Kbytes
Boot1 size : 4096 Kbytes
Boot2 size : 4096 Kbytes
RPMB size : 4096 Kbytes
Partition config : (0x08) 00001000
Boot partition enable : Boot partition 1
(Bus width = 1Bit)
Boot ACK : No boot acknowledge sent (default)
Boot bus conditions : (0x00) 00000000
Boot bus width : x1 (sdr) or x4 (ddr) bus width in boot operation mode (default)
Reset boot bus conditions : Reset bus width to x1, single data rate and backward compatible timings after boot operation (default)
Boot mode : Use single data rate + backward compatible timings in boot operation (default)
RST_n function : (0x00) RST_n signal is temporary disabled (default)
Partitioning support : Device supports partitioning features
Enhanced attribute : Device can have enhanced technological features in partitions and user data area.
Max enhanced data size: 1908736 Kbytes
Partitions attribute : 0x0
Part setting completed: 0x0
GP partition 1 size : 0 b
GP partition 2 size : 0 b
GP partition 3 size : 0 b
GP partition 4 size : 0 b
Enhanced area size : (0x0) 0 b
Enhanced area start : (0x0) 0 b
---------------------------------------------------------------Searching Android build info...
Not found
---------------------------------------------------------------
Backup EXT_CSD saved to file C:/Program Files/Medusa Pro Software/EXT_CSD Backups/H4G2b_27_09_2018_12_55_26.bin.
Connect successful.
---------------------------------------------------------------
SW: 1.6.7; FW: 1.24.
P00: PART_EE (00000001, 00743FFF) 3720 MB
Repairing from file "C:/Program Files/Medusa Pro Software/firmwareFolder/SAMSUNG_SM-J110H_EMMC.srf".
Write data verification is enabled.
Switched to boot area partition 1.
Writing BOOT1 partition... Done.
Switched to boot area partition 2.
Writing BOOT2 partition... Done.
Switched to user area.
Writing GPT partition... Done.
Writing SBOOT partition... Done.
Writing SBOOT2 partition... Done.
Writing wfixnv1 partition... Done.
Writing wfixnv2 partition... Done.
Writing tdfixnv1 partition... Done.
Writing tdfixnv2 partition... Done.
Writing WDSP partition... Done.
Writing MODEM partition... Done.
Writing MODEM2 partition... Done.
Writing TDDSP partition... Done.
Writing FOTA_SIG partition... Done.
Writing wruntimenv1 partition... Done.
Writing wruntimenv2 partition... Done.
Writing tdruntimenv1 partition... Done.
Writing tdruntimenv2 partition... Done.
Writing PARAM partition... Done.
Writing EFS partition... Done.
Writing PRODNV partition... Done.
Writing RESERVED2 partition... Done.
Writing KERNEL partition... Done.
Writing RECOVERY partition... Done.
Writing PERSDATA partition... Done.
Writing CSC partition... Done.
Smart Repair is successfully complete.
SW: 1.6.7; FW: 1.24.
Disconnected.